The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Oct. 04, 2019
Applicant:

Bizlink International Corp., New Taipei, TW;

Inventors:

Hsin-Tuan Hsiao, New Taipei, TW;

Jui-Hung Chien, New Taipei, TW;

Assignee:

BizLink International Corp., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/50 (2006.01); H01R 13/504 (2006.01); H01R 12/62 (2011.01); H01R 24/60 (2011.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H01R 43/02 (2006.01); H05K 1/11 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/504 (2013.01); H01R 12/62 (2013.01); H01R 24/60 (2013.01); H01R 43/0256 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H01R 2107/00 (2013.01); H05K 1/117 (2013.01);
Abstract

A high speed wire end connector manufacturing method includes the following steps. First, a cable is soldered to a printed circuit board, and then an inner film is formed to cover a portion of the cable and a portion of the printed circuit board by an insert molding process. Another portion of the printed circuit board is passed through a guide hole of an outer casing, and a molded bonding layer is formed by an outer molding process to bond to the outer casing and the inner film. In addition, a metal spring latch is fixed on the outer casing. In addition, a high speed wire end connector is also disclosed herein.


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