The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

May. 10, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andreas Meiser, Sauerlach, DE;

Till Schloesser, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 21/477 (2006.01); H01L 21/22 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66734 (2013.01); H01L 21/0274 (2013.01); H01L 29/0634 (2013.01); H01L 21/22 (2013.01); H01L 21/477 (2013.01);
Abstract

The disclosure relates to a method for producing a semiconductor device. The method includes providing a semiconductor body having first dopants of a first conductivity type and second dopants of a second conductivity type. The method also includes forming a first trench in the semiconductor body via a first mask, and filling the first trench with a semiconductor filling material. The method further includes forming a superjunction structure by introducing a portion of the first dopants from a region of the semiconductor body into the semiconductor filling material, forming a second trench in the semiconductor body via a second mask, which is formed in a manner self-aligned with respect to the first mask, and forming a trench structure in the second trench.


Find Patent Forward Citations

Loading…