The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Oct. 01, 2019
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Motohito Hori, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Akira Hirao, Matsumoto, JP;

Mai Saitou, Matsumoto, JP;

Ryoichi Kato, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 25/16 (2006.01); H01L 23/427 (2006.01); H01L 23/50 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 23/50 (2013.01);
Abstract

Semiconductor equipment includes semiconductor modules sealed with a resin, each having first and second connection terminals exposed from the resin, a capacitor including third and fourth connection terminals, a cooler directly contacting the semiconductor modules and the capacitor, a busbar including a first busbar connecting the first connection terminal to the third connection terminal, a second busbar connecting the second connection terminal to the fourth connection terminal, and a first insulating layer sandwiched by the first and second busbars, main surfaces of the first and second busbars being parallel to each other, a control circuit board configured to control the semiconductor modules, and a heat transfer component including a main body connected to the cooler, and a second insulating layer arranged on the main body, the main body being in contact with the busbar and the control circuit via the second insulating layer.


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