The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Sep. 16, 2019
Asahi Kasei Microdevices Corporation, Tokyo, JP;
Toshiaki Fukunaka, Tokyo, JP;
Asahi Kasei Microdevices Corporation, Tokyo, JP;
Abstract
To achieve the miniaturization of and the enhancement of the strength of a semiconductor element. In a semiconductor element () having a shape of a rectangular parallelepiped, on four sides forming one surface of the rectangular parallelepiped in plan view, portions of at least one of a first lead frame () and a second lead frame () are respectively in contact with the four sides and are exposed from a sealing portion () to serve as connection terminals (P, P, N, N), and in each of two pairs each composed of the two sides, facing each other, of the four sides, the portion of the first lead frame () is in contact with one of the two sides and is exposed as the connection terminal (P, P), the portion of the second lead frame () is in contact with the other of the two sides and is exposed as the connection terminal (N, N), and the connection terminal (P, P) formed by the first lead frame () and the connection terminal (N, N) formed by the second lead frame () are disposed at positions that are axially symmetric with each other.