The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Oct. 08, 2019
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Detian Huang, Tokyo, JP;

Yoshinori Tsukamoto, Tokyo, JP;

Masashi Moriyama, Tokyo, JP;

Hideyuki Sagawa, Tokyo, JP;

Takahiro Sugiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 11/06 (2006.01); H01B 1/02 (2006.01); H01B 13/22 (2006.01); H01B 7/30 (2006.01); H01B 11/18 (2006.01);
U.S. Cl.
CPC ...
H01B 11/06 (2013.01); H01B 1/026 (2013.01); H01B 7/303 (2013.01); H01B 11/1808 (2013.01); H01B 13/22 (2013.01);
Abstract

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an outer surface of the crack suppressing layer. The crack suppressing layer suppresses the occurrence of a cracking in the plating layer by bending while moving in a longitudinal direction of the cable relative to a bending of the insulator.


Find Patent Forward Citations

Loading…