The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Jan. 06, 2017
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Sang Kook Kim, Gyeonggi-do, KR;

Seong Hwan Park, Gyeonggi-do, KR;

Min Ju Lim, Jeollabuk-do, KR;

Sung Hoon Cho, Gyeonggi-do, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); C08F 220/18 (2006.01); C08F 224/00 (2006.01); B32B 15/08 (2006.01); G06F 3/044 (2006.01); C08L 33/06 (2006.01); C08L 33/14 (2006.01); C08F 20/32 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B32B 15/08 (2013.01); C08F 220/18 (2013.01); C08F 224/00 (2013.01); C08L 33/066 (2013.01); C08L 33/14 (2013.01); G06F 3/044 (2013.01); C08F 20/32 (2013.01); C08F 2500/02 (2013.01); C08L 2203/16 (2013.01); C08L 2205/03 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01);
Abstract

A film touch sensor includes a separation layer; a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer that is a cured layer of a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group, such that it is possible to suppress thermal damage such as wrinkles, or cracks of the insulation layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.


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