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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10866512 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Oct. 19, 2016

Positive photosensitive resin composition

Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Kentaro Furue, Tokyo, JP;

Yuki Miyaishi, Tokyo, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/105 (2006.01); H01L 51/50 (2006.01); H05B 33/10 (2006.01); H05B 33/22 (2006.01); G03F 7/039 (2006.01); H01L 27/32 (2006.01); G03F 7/038 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0236 (2013.01); G03F 7/0233 (2013.01); G03F 7/0392 (2013.01); G03F 7/105 (2013.01); H01L 51/50 (2013.01); H05B 33/10 (2013.01); H05B 33/22 (2013.01); G03F 7/0388 (2013.01); H01L 27/3246 (2013.01); H01L 27/3283 (2013.01);
Abstract

Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250° C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.

Find Patent Forward Citations

Furue, Kentaro. (2020). Positive photosensitive resin composition (U.S. Patent No. 10866512). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10866512

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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