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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10866032 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Mar. 06, 2018

Polymer-based pulsating heat pipe and manufacturing method thereof

Applicant:

Korea Advanced Institute of Science and Technology, Dejeon, KR;

Inventors:

Sung Jin Kim, Dejeon, KR;

Jonghyun Lim, Dejeon, KR;

Assignee:

Korea Advanced Institute of Science and Technology, Daejeon, KR;

Attorneys:

Norton Rose Fulbright US LLP

James R. Crawford

Primary Examiner:

Henry T Crenshaw

Assistant Examiner:

Kamran Tavakoldavani

Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01); B32B 3/26 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B23P 15/26 (2006.01); B32B 37/00 (2006.01); H01L 23/427 (2006.01); F28F 21/08 (2006.01); F28F 21/06 (2006.01); B32B 38/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0241 (2013.01); B23P 15/26 (2013.01); B32B 3/26 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 37/0076 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0283 (2013.01); F28F 21/06 (2013.01); F28F 21/089 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); B32B 2038/0092 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/7242 (2013.01); F28F 2230/00 (2013.01); F28F 2245/00 (2013.01); F28F 2265/16 (2013.01); H01L 23/3737 (2013.01);
Abstract

Provided is a polymer-based pulsating heat pipe that has high flexibility and is applicable to a flexible electronic device. In addition, by surrounding a channel by a multilayer film including a first blocking layer and coating a bonding part with a second blocking layer in order to prevent air from penetrating through the bonding part between upper and lower films, an inner portion of the channel may be maintained in a vacuum state and heat performance of the polymer-based pulsating heat pipe may be maintained. In addition, although the polymer-based pulsating heat pipe according to the present invention has high flexibility, it is lightweight and has heat performance superior to that of copper, thereby effectively cooling the flexible electronic device.

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