The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Aug. 30, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Naoyuki Kushihara, Annaka, JP;
Yuki Kudo, Annaka, JP;
Kazuaki Sumita, Annaka, JP;
Yoshihiro Tsutsumi, Annaka, JP;
Yoshihira Hamamoto, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08L 63/04 (2006.01); C08L 79/08 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); B01J 31/02 (2006.01); C08G 59/14 (2006.01); C08K 5/3415 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B01J 31/0247 (2013.01); C08G 59/14 (2013.01); C08G 59/686 (2013.01); C08K 5/3415 (2013.01);
Abstract
Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: