The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Mar. 05, 2019
Applicant:

Teijin Limited, Osaka, JP;

Inventors:

Shinichiro Shoji, Osaka, JP;

Kouhei Endo, Osaka, JP;

Masaya Shibano, Osaka, JP;

Assignee:

TEIJIN LIMITED, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/40 (2006.01); C08G 59/68 (2006.01); C08K 5/29 (2006.01); C08L 63/00 (2006.01); C08G 59/50 (2006.01); C07D 491/113 (2006.01); C08K 5/18 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4042 (2013.01); C07D 491/113 (2013.01); C08G 59/5033 (2013.01); C08G 59/686 (2013.01); C08K 5/18 (2013.01); C08K 5/29 (2013.01); C08L 63/00 (2013.01);
Abstract

A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes:


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