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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10865152 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Mar. 14, 2019

Polycrystalline diamond compact

Applicant:

Sf Diamond Co., Ltd., Zhengzhou, CN;

Inventors:

Caili Wang, Zhengzhou, CN;

Dongpeng Zhao, Zhengzhou, CN;

Saifei Yang, Zhengzhou, CN;

Haijiang Fang, Zhengzhou, CN;

Assignee:

SF DIAMOND CO., LTD., Zhengzhou, CN;

Attorneys:

Matthias Scholl P.C.

Matthias Scholl

Primary Examiner:

Matthew R Buck

Assistant Examiner:

Patrick F Lambe

Int. Cl.
CPC ...
C04B 37/02 (2006.01); C22C 26/00 (2006.01); E21B 10/567 (2006.01); E21B 10/46 (2006.01);
U.S. Cl.
CPC ...
C04B 37/028 (2013.01); C22C 26/00 (2013.01); E21B 10/46 (2013.01); E21B 10/567 (2013.01); E21B 10/5676 (2013.01); C04B 2237/363 (2013.01); C04B 2237/401 (2013.01); C04B 2237/68 (2013.01);
Abstract

A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer bonded to the cemented carbide substrate. The cemented carbide substrate is cylindrical and includes a circumferential wall. The polycrystalline diamond layer includes a central part including between 8 and 15 wt. % of cobalt and an outer part including between 0.5 and 2 wt. % of cobalt. The outer part is a columnar ring belt and includes a chamfer. The outer part includes an upper surface, a side surface connected to the circumferential wall of the cemented carbide substrate, and a chamfer surface connecting the upper surface and the side surface. The chamfer includes a first terminal connected to the upper surface of the outer part and a second terminal connected to the side surface of the outer part.

Find Patent Forward Citations

Wang, Caili. (2020). Polycrystalline diamond compact (U.S. Patent No. 10865152). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10865152

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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