The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Mar. 06, 2018
Coretech System Co., Ltd., Chupei, TW;
Chih-Chung Hsu, Chupei, TW;
Tung-Huan Su, Chupei, TW;
Hsien-Sen Chiu, Chupei, TW;
Chia-Hsiang Hsu, Chupei, TW;
Rong-Yeu Chang, Chupei, TW;
CORETECH SYSTEMS CO., LTD., Chupei, TW;
Abstract
A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.