logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10863817 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Sep. 10, 2018

Modular attachment matrix array

Applicant:

Sentry Solutions Products Group Llc, Virginia Beach, VA (US);

Inventors:

Eric M. Yeates, Virginia Beach, VA (US);

Nicholas A. Ferros, Virginia Beach, VA (US);

Frederick W. Storms, Jr., Virginia Beach, VA (US);

Assignee:

Sentry Solutions Products Group LLC, Virginia Beach, unknown;

Attorney:

Shaddock Law Group, PC

Primary Examiner:

Corey N Skurdal

Int. Cl.
CPC ...
A45F 5/00 (2006.01); A45C 3/00 (2006.01); F41C 33/04 (2006.01); A45F 5/02 (2006.01); A41D 1/04 (2006.01); A41D 15/00 (2006.01); A41D 27/20 (2006.01); A45F 3/04 (2006.01); A45C 13/30 (2006.01); A45F 3/00 (2006.01);
U.S. Cl.
CPC ...
A45F 5/00 (2013.01); A41D 1/04 (2013.01); A41D 15/00 (2013.01); A41D 27/20 (2013.01); A45C 3/001 (2013.01); A45F 3/04 (2013.01); A45F 5/02 (2013.01); F41C 33/046 (2013.01); A41D 2400/48 (2013.01); A45C 2013/306 (2013.01); A45F 2003/001 (2013.01);
Abstract

A modular attachment matrix array having a matrix array layer, wherein the matrix array layer comprises a plurality of spaced apart matrix array apertures, wherein each of the matrix array apertures is formed through the matrix array layer and is formed as an elongated octagon, and wherein the matrix array apertures are arranged in a repeating sequence of equally spaced rows and equally spaced columns. In certain exemplary embodiments, the matrix array layer is at least partially attached or coupled to at least a portion of a carrier material.

Find Patent Forward Citations

Loading…