The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

May. 04, 2018
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventor:

Chi-Feng Huang, Taipei, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); H05K 1/14 (2006.01); H05K 1/09 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/14 (2013.01); H05K 1/141 (2013.01); H05K 1/185 (2013.01); H05K 3/423 (2013.01); H05K 3/3442 (2013.01); H05K 3/403 (2013.01); H05K 2201/09009 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An electronic module is disclosed, wherein the electronic module comprises: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board, wherein a second circuit board is disposed under the bottom surface of the first circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the second circuit board and extended onto a wettable flank of the electrode structure to form a soldering structure, wherein said soldering structure comprises an outer surface that is located above the bottom surface of the first circuit board and outside the outmost portion of the lateral surface of the first circuit board.


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