The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

May. 27, 2015
Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Toshifumi Matsushima, Ageo, JP;

Ayumu Tateoka, Ageo, JP;

Fujio Kuwako, Saitama, JP;

Shigeru Itabashi, Ageo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); C09D 123/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C09D 123/0853 (2013.01); H05K 1/0298 (2013.01); H05K 3/46 (2013.01); H05K 3/4682 (2013.01); B32B 2457/08 (2013.01);
Abstract

There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.


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