The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jan. 30, 2019
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Koichi Shiozawa, Hong Kong, HK;
Masashi Shiraishi, Hong Kong, HK;
Jumpei Tsuchiya, Hong Kong, HK;
Lik Hang Ken Wan, Hong Kong, HK;
Toyotaka Kobayashi, Hong Kong, HK;
Hironobu Hayashi, Hong Kong, HK;
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 1/04 (2006.01); H04R 3/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0061 (2013.01); B81C 1/00309 (2013.01); H04R 1/04 (2013.01); H04R 3/00 (2013.01); H04R 19/005 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0792 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.