The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Dec. 28, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Masaharu Fujiya, Nagaokakyo, JP;

Kazushi Watanabe, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/64 (2006.01); H03H 9/72 (2006.01); H03H 9/08 (2006.01); H04B 1/38 (2015.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H03H 9/08 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02913 (2013.01); H03H 9/059 (2013.01); H03H 9/0576 (2013.01); H03H 9/1078 (2013.01); H03H 9/1085 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/6489 (2013.01); H03H 9/725 (2013.01); H04B 1/38 (2013.01);
Abstract

An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.


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