The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Apr. 30, 2019
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventor:
Mikihiro Noma, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H05K 3/10 (2006.01); H01L 27/32 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H01L 51/52 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H01L 27/323 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01); H01L 51/5281 (2013.01); H05K 1/0326 (2013.01); H05K 1/0393 (2013.01); H05K 3/0047 (2013.01); H05K 3/107 (2013.01); G06F 2203/04103 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01);
Abstract
A method of producing a substrate includes an imprint layer forming step of forming an imprint layer on a surface of a foundation layer and boring a contact hole through a location in the imprint layer that overlaps at least a part of a foundation conductive layer of the foundation layer, a groove forming step of, by partially depressing a surface of the imprint layer, forming a conductive layer forming groove at least a part of which communicates with the contact hole, and a conductive layer forming step of forming a conductive layer in the conductive layer forming groove and the contact hole.