The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
May. 22, 2017
Applicant:
Konica Minolta Laboratory U.s.a., Inc., San Mateo, CA (US);
Inventor:
Jun Amano, Hillsborough, CA (US);
Assignee:
Konica Minolta Laboratory U.S.A., Inc., San Mateo, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); C23C 14/58 (2006.01); C23C 16/56 (2006.01); C23C 16/40 (2006.01); C23C 14/08 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5203 (2013.01); C23C 14/088 (2013.01); C23C 14/58 (2013.01); C23C 16/409 (2013.01); C23C 16/56 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H01L 2251/305 (2013.01); H01L 2251/5338 (2013.01);
Abstract
A method of fabricating a flexible transparent conductive electrode layer includes depositing a correlated metal film having a thickness between 10 nm and 100 nm on a flexible transparent substrate, annealing the correlated metal film with the UV pulses, and maintaining a temperature of the flexible transparent substrate below 80° C. during the depositing and annealing.