The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Sep. 26, 2019
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Kazuhisa Torigoe, Tokyo, JP;

Toshiaki Ono, Tokyo, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0288 (2006.01); C30B 29/06 (2006.01); C30B 30/04 (2006.01); C30B 15/30 (2006.01); C30B 15/20 (2006.01); C30B 25/18 (2006.01); C30B 33/02 (2006.01); H01L 21/322 (2006.01); H01L 27/146 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0288 (2013.01); C30B 15/203 (2013.01); C30B 15/305 (2013.01); C30B 25/18 (2013.01); C30B 29/06 (2013.01); C30B 30/04 (2013.01); C30B 33/02 (2013.01); H01L 21/3225 (2013.01); H01L 27/14687 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/02664 (2013.01);
Abstract

A method of manufacturing an epitaxial silicon wafer that includes growing a silicon single crystal ingot doped with a boron concentration of 2.7×10atoms/cmor more and 1.3×10atoms/cmor less by the CZ method; producing a silicon substrate by processing the silicon single crystal ingot; and forming an epitaxial layer on a surface of the silicon substrate. During growing of the silicon single crystal ingot, the pull-up conditions of the silicon single crystal ingot are controlled so that the boron concentration Y (atoms/cm) and an initial oxygen concentration X (×10atoms/cm) satisfy the expression X≤−4.3×10Y+16.3.


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