The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

May. 26, 2020
Applicant:

Rfhic Corporation, Anyang, KR;

Inventor:

Won Sang Lee, Chapel Hill, NC (US);

Assignee:

RFHIC CORPORATION, Anyang, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/778 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 27/085 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/66 (2006.01); H01L 21/8232 (2006.01); H01L 21/8252 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 21/76898 (2013.01); H01L 21/8232 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 27/0605 (2013.01); H01L 27/085 (2013.01); H01L 29/0619 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/401 (2013.01); H01L 29/408 (2013.01); H01L 29/4175 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/7787 (2013.01); H01L 21/8252 (2013.01); H01L 21/823481 (2013.01); H01L 24/03 (2013.01); H01L 24/29 (2013.01); H01L 24/94 (2013.01); H01L 29/0657 (2013.01); H01L 29/402 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29009 (2013.01); H01L 2224/29022 (2013.01); H01L 2224/29025 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01);
Abstract

Methods for processing a semiconductor transistor are provided, where the semiconductor transistor includes a substrate, an epitaxial layer, and transistor components that are formed on the epitaxial layer. The method includes: removing a portion of the substrate that is disposed below a portion of the transistor components, to thereby expose a portion of a bottom surface of the epitaxial layer; forming an electrically insulating layer on the exposed portion of the bottom surface of the epitaxial layer; forming a via that extends from a bottom surface of the insulating layer to a bottom surface of one of the transistor components; depositing at least one metal layer on the bottom surface of the insulating layer, on a side wall of the via and on the bottom surface of one of the transistor components; and applying a solder paste to a bottom surface of the at least one metal layer.


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