The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
May. 24, 2019
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventor:
Toshiya Ishio, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/1131 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/8183 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor chip stack includes a first semiconductor chip, a second semiconductor chip, and a connection via which the first electrode and the second electrode are electrically connected to each other. The connection includes a first column and a second column. The first column is constituted by a material having a higher degree of activity with respect to heat than a material that constitutes the second column and is smaller in volume than the second column. Further, the connection has an aspect ratio of 0.5 or higher in a height direction.