The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jun. 20, 2019
Applicant:
Fujitsu Limited, Kawasaki, JP;
Inventor:
Daijiro Ishibashi, Yokohama, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01P 5/107 (2006.01); H01Q 1/22 (2006.01); H01Q 13/02 (2006.01); H01P 5/08 (2006.01); H01P 11/00 (2006.01); H01L 23/28 (2006.01); H01L 23/12 (2006.01); H01P 3/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/12 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01P 3/12 (2013.01); H01P 5/08 (2013.01); H01P 5/107 (2013.01); H01P 11/00 (2013.01); H01Q 1/2283 (2013.01); H01Q 13/02 (2013.01); H01L 21/56 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01);
Abstract
A high frequency module includes: a package section including a semiconductor chip, a first portion of a backshort being integrated with the semiconductor chip by a first resin, and a first rewiring line electrically coupled to the semiconductor chip and including a portion to be an antenna coupler; and a waveguide with which a second portion of the backshort is integrated, wherein the package section and the waveguide are integrated by a second resin, to position the portion to be the antenna coupler between the waveguide and the backshort.