The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Mar. 19, 2018
Applicant:
Scientific Components Corporation, Brooklyn, NY (US);
Inventor:
Aaron Vaisman, New York, NY (US);
Assignee:
Scientific Components Corporation, Brooklyn, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 25/18 (2013.01); H01L 2223/6622 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15153 (2013.01);
Abstract
LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.