The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Dec. 03, 2018
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Christian Rivero, Rousset, FR;
Pascal Fornara, Pourrieres, FR;
Guilhem Bouton, Peynier, FR;
Mathieu Lisart, Aix en Provence, FR;
Assignee:
STMicroelectronics (Rousset) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 21/8234 (2006.01); H01L 23/528 (2006.01); H01L 27/088 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 21/31111 (2013.01); H01L 21/768 (2013.01); H01L 21/76816 (2013.01); H01L 21/823475 (2013.01); H01L 23/522 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/585 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 27/088 (2013.01); H01L 21/76802 (2013.01);
Abstract
An integrated circuit includes a semiconductor substrate and a multitude of electrically conductive pads situated between component zones of the semiconductor substrate and a first metallization level of the integrated circuit, respectively. The multitude of electrically conductive pads are encapsulated in an insulating region and include: first pads, in electrical contact with corresponding first component zones, and at least one second pad, not in electrical contact with a corresponding second component zone.