The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jun. 16, 2019
Applicant:
Amulaire Thermal Technology, Inc., New Taipei, TW;
Inventors:
Tze-Yang Yeh, New Taipei, TW;
Chun-Lung Wu, New Taipei, TW;
Assignee:
AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 29/739 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/3737 (2013.01); H01L 29/7393 (2013.01);
Abstract
An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.