The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jun. 20, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Akitoshi Shirao, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); H02M 7/5387 (2007.01); H01L 21/54 (2006.01); H01L 23/31 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H02M 7/53871 (2013.01);
Abstract
A semiconductor device includes a case surrounding a region that contains semiconductor elements and wires. The case is provided with s(an integer greater than k and equal to or greater than three)-pieces of discharge paths for discharging an encapsulation member to the region. The s-pieces of discharge paths are provided so as to surround the region as seen in a plan view. The s-pieces of discharge paths are spirally provided as seen in a plan view.