The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Jan. 24, 2018
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Daiki Maeda, Nagoya, JP;

Yutaka Unno, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01); C23C 16/505 (2006.01); C23C 16/509 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); C23C 16/4586 (2013.01); C23C 16/505 (2013.01); C23C 16/5096 (2013.01); H01J 37/32559 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 37/32082 (2013.01); H01J 2237/0266 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01);
Abstract

A wafer support of the present invention includes shield sheet embedded in the ceramic base between the plasma generation electrode and the heater electrode in a state not contacting both the electrodes; and a shield pipe electrically connected to the shield sheet and laid to extend to outside of the ceramic base from the surface of the ceramic base on the side opposite to the wafer placement surface, wherein the wiring member for the plasma generation electrode is inserted through inside of the shield pipe in a state not contacting the shield pipe, and the wiring member for the heater electrode is disposed outside the shield pipe in a state not contacting the shield pipe.


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