The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Dec. 20, 2017
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Hsien-Chun Peng, Taoyuan, TW;

Chun-Ching Yen, Taoyuan, TW;

Kun-Te Chen, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/04 (2006.01); H01F 41/061 (2016.01); H01F 27/26 (2006.01); H01F 27/06 (2006.01); H01F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/043 (2013.01); H01F 17/045 (2013.01); H01F 27/06 (2013.01); H01F 27/266 (2013.01); H01F 41/061 (2016.01); H01F 2003/106 (2013.01); H01F 2027/065 (2013.01); H01F 2027/297 (2013.01);
Abstract

A magnetic assembly includes a magnetic core, two windings, and a base. The windings are arranged around the magnetic core, and each of the windings has two leading sections. The base carries the magnetic core, and comprises a frame part, a pin base, and two first pins and two second pins disposed on the pin base. The pin base is connected with the frame part, and has four through holes. Two first pins are disposed in two of the through holes, and two second pins are disposed in the other two of the through holes. Each of the first pins and the second pins has two extending parts extended from the first surface and the second surface respectively, and the leading sections of the windings are connected with the first pins and the second pins respectively. Therefore, the advantages of decreasing the production costs and product standardization are achieved.


Find Patent Forward Citations

Loading…