The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

May. 03, 2018
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventors:

Stephen Bowling, Chandler, AZ (US);

Igor Wojewoda, Tempe, AZ (US);

Manivannan Balu, Bangalore, IN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/00 (2006.01); G06F 11/07 (2006.01); G06F 13/40 (2006.01);
U.S. Cl.
CPC ...
G06F 11/079 (2013.01); G06F 11/0745 (2013.01); G06F 13/409 (2013.01);
Abstract

A semiconductor die includes a feedback path coupled to the output pin, and an integrity monitor circuit (IMC). The output pin is communicatively coupled to the logic. The IMC is configured to receive a data value. The IMC is further configured to receive measured data value from the output pin routed through the feedback path, compare the data value and the measured data value, and, based on the comparison, determine whether an error has occurred.


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