Electronic device with bonding structure

Abstract

An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.