The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Jan. 09, 2019
Applicant:
Dell Products L.p., Round Rock, TX (US);
Inventors:
Ting-Chiang Huang, New Taipei, TW;
Tse-An Chu, Taipei, TW;
Assignee:
Dell Products L.P., Round Rock, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); F28F 3/00 (2006.01); F28F 3/02 (2006.01); F28F 21/00 (2006.01); F28F 21/08 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); F28F 3/08 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
F28F 3/08 (2013.01); F28F 21/084 (2013.01); F28F 21/085 (2013.01); G06F 1/203 (2013.01); H01L 21/4871 (2013.01); H01L 23/467 (2013.01); F28F 2215/04 (2013.01); F28F 2275/06 (2013.01); G06F 2200/201 (2013.01);
Abstract
A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.