The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

May. 24, 2017
Applicant:

Kuraray Co., Ltd., Kurashiki, JP;

Inventors:

Kaori Maeda, Tainai, JP;

Noboru Higashida, Tainai, JP;

Takao Hoshiba, Tainai, JP;

Assignee:

KURARAY CO., LTD., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08L 51/06 (2006.01); C08L 101/00 (2006.01); G02B 5/30 (2006.01); B32B 27/30 (2006.01); C08L 33/08 (2006.01); C08L 33/12 (2006.01); C08L 51/04 (2006.01); C09J 201/02 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B32B 27/30 (2013.01); C08L 33/08 (2013.01); C08L 33/12 (2013.01); C08L 51/04 (2013.01); C08L 51/06 (2013.01); C08L 101/00 (2013.01); G02B 5/30 (2013.01); G02B 5/305 (2013.01); C08L 2207/53 (2013.01); C09J 201/02 (2013.01); C09J 2203/326 (2013.01); C09J 2301/416 (2020.08);
Abstract

Provided is a thermoplastic resin composition that can be firmly bonded to an adherend with an active energy ray-curable adhesive provided therebetween, and provided are a molded product and a film each including such a thermoplastic resin composition. Also provided are a thermoplastic resin composition that is less likely to be whitened even when the adhesive permeates thereinto and a molded product and a film each including such a thermoplastic resin composition. The thermoplastic resin composition according to the present disclosure contains 70 to 95 mass % of a thermoplastic resin and 5 to 30 mass % of a multilayer structure polymer (C) having a multilayer particle structure, and the multilayer structure polymer (C) has a median diameter Da of no less than 200 nm and less than 500 nm when the median diameter Da is measured through a laser diffraction/scattering technique with the thermoplastic resin composition dissolved in acetone.


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