The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Oct. 23, 2015
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventor:

Tomoyuki Hirayama, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/18 (2006.01); G02B 1/04 (2006.01); C08L 63/00 (2006.01); C08G 59/22 (2006.01); G03F 7/038 (2006.01); H05K 1/02 (2006.01); C08G 59/68 (2006.01); G03F 7/004 (2006.01); H01L 51/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
C08G 59/186 (2013.01); C08G 59/226 (2013.01); C08G 59/68 (2013.01); C08L 63/00 (2013.01); G02B 1/045 (2013.01); G02B 1/046 (2013.01); G02B 1/048 (2013.01); G03F 7/0043 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); H01L 51/0034 (2013.01); H05K 1/0274 (2013.01); H01L 51/0097 (2013.01); H05K 1/118 (2013.01); H05K 2201/0108 (2013.01); H05K 2203/0514 (2013.01); H05K 2203/0525 (2013.01);
Abstract

Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.


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