The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Nov. 05, 2018
Applicants:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Sumitomo Riko Company Limited, Komaki, JP;

Inventors:

Yuji Homma, Nagoya, JP;

Taisuke Nishimura, Toukai, JP;

Masami Endo, Komaki, JP;

Norimasa Kuki, Komaki, JP;

Daiki Mimpo, Komaki, JP;

Ryusuke Yamada, Komaki, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60G 21/055 (2006.01); B29C 65/00 (2006.01); F16F 1/16 (2006.01); F16F 1/38 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B60G 21/0551 (2013.01); B29C 66/53241 (2013.01); B29L 2031/721 (2013.01); B60G 2204/1222 (2013.01); B60G 2204/41 (2013.01); B60G 2206/73 (2013.01); B60G 2206/821 (2013.01); B60G 2206/91 (2013.01); F16F 1/16 (2013.01); F16F 1/3856 (2013.01); F16F 2226/042 (2013.01); F16F 2228/08 (2013.01);
Abstract

A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings. After adhesion, a bonding surface is bonded by pressure.


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