The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Jun. 26, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Toshiro Murayama, Suwa, JP;

Yuma Fukuzawa, Matsumoto, JP;

Shunya Fukuda, Azumino, JP;

Kazuaki Uchida, Suwa, JP;

Shunsuke Watanabe, Matsumoto, JP;

Noriaki Okazawa, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14274 (2013.01);
Abstract

A head includes a flow path substrate including a flow path of the liquid in the flow path substrate, a nozzle plate which is attached to the flow path substrate and in which the nozzle is formed, a pressure chamber substrate that is attached to a location facing the nozzle plate with the flow path substrate interposed therebetween and that has a pressure chamber, and a pressure generation portion that operates according to an electrical signal from a wiring substrate coupled to an electrode provided on the pressure chamber substrate and that changes a pressure of the pressure chamber to eject the liquid from the nozzle, in which the nozzle plate and the wiring substrate are disposed such that the nozzle plate does not overlap a coupling portion between the wiring substrate and the electrode when viewed in a thickness direction of the flow path substrate.


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