The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Feb. 04, 2019
Applicant:
Ifs Industries Inc., Reading, PA (US);
Inventors:
Scott Zaddack, New London, WI (US);
Joel Snyder, Wyomissing, PA (US);
Andrew Michael Kawaja, San Francisco, CA (US);
William L. Bunnelle, Ham Lake, MN (US);
Assignee:
IFS Industries Inc., Reading, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 5/26 (2006.01); B32B 5/32 (2006.01); B32B 7/14 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 9/06 (2006.01); B32B 15/04 (2006.01); B32B 15/10 (2006.01); B32B 15/12 (2006.01); B32B 15/14 (2006.01); B32B 15/18 (2006.01); B32B 17/00 (2006.01); B32B 21/02 (2006.01); B32B 21/04 (2006.01); B32B 21/06 (2006.01); B32B 21/08 (2006.01); B32B 21/10 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 29/00 (2006.01); B32B 29/02 (2006.01); B32B 27/40 (2006.01); B32B 37/10 (2006.01); C09J 5/00 (2006.01); C09J 123/00 (2006.01); C09J 123/14 (2006.01); C09J 123/20 (2006.01); C09J 131/04 (2006.01); C09J 153/00 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 5/02 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 5/26 (2013.01); B32B 5/32 (2013.01); B32B 7/14 (2013.01); B32B 9/002 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 9/042 (2013.01); B32B 9/045 (2013.01); B32B 9/046 (2013.01); B32B 9/047 (2013.01); B32B 9/06 (2013.01); B32B 15/043 (2013.01); B32B 15/046 (2013.01); B32B 15/10 (2013.01); B32B 15/12 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 17/00 (2013.01); B32B 21/02 (2013.01); B32B 21/04 (2013.01); B32B 21/042 (2013.01); B32B 21/047 (2013.01); B32B 21/06 (2013.01); B32B 21/08 (2013.01); B32B 21/10 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/30 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/327 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 29/005 (2013.01); B32B 29/007 (2013.01); B32B 29/02 (2013.01); B32B 37/10 (2013.01); B32B 37/12 (2013.01); B32B 37/1292 (2013.01); C09J 5/00 (2013.01); C09J 123/00 (2013.01); C09J 123/14 (2013.01); C09J 123/20 (2013.01); C09J 131/04 (2013.01); C09J 153/00 (2013.01); C09J 175/04 (2013.01); B32B 2037/1215 (2013.01); B32B 2037/1223 (2013.01); B32B 2250/02 (2013.01); B32B 2262/067 (2013.01); B32B 2262/101 (2013.01); B32B 2270/00 (2013.01); B32B 2307/50 (2013.01); B32B 2307/702 (2013.01); B32B 2307/704 (2013.01); B32B 2307/72 (2013.01); B32B 2307/732 (2013.01); B32B 2419/04 (2013.01); B32B 2437/02 (2013.01); B32B 2457/00 (2013.01); B32B 2479/00 (2013.01); B32B 2509/00 (2013.01); B32B 2535/00 (2013.01); B32B 2553/00 (2013.01); B32B 2555/00 (2013.01); B32B 2605/00 (2013.01); B32B 2607/00 (2013.01); C08G 2170/20 (2013.01); C08L 2205/03 (2013.01); C09J 2423/00 (2013.01); C09J 2423/10 (2013.01); C09J 2431/00 (2013.01); C09J 2453/00 (2013.01); C09J 2475/00 (2013.01);
Abstract
An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.