The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Jul. 15, 2016
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Yuichi Tomizawa, Tochigi, JP;

Yu Kubodera, Tochigi, JP;

Daisuke Koshino, Tochigi, JP;

Shogo Nagayoshi, Tochigi, JP;

Takahiro Otsuka, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 3/10 (2006.01); B23F 21/02 (2006.01); B24D 7/18 (2006.01); B24D 3/00 (2006.01); B24D 3/06 (2006.01); B24B 19/00 (2006.01); B24D 5/06 (2006.01); B24D 18/00 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
B24D 3/10 (2013.01); B23F 21/02 (2013.01); B23F 21/026 (2013.01); B24B 19/009 (2013.01); B24D 3/00 (2013.01); B24D 3/06 (2013.01); B24D 5/06 (2013.01); B24D 7/18 (2013.01); B24D 18/0018 (2013.01); C09K 3/1409 (2013.01); C04B 2235/427 (2013.01);
Abstract

Provided are: an electroplated tool; a screw-shaped grindstone for grinding a gear; a method for manufacturing the electroplated tool; and a method for manufacturing the crew-shaped grindstone for grinding a gear. Said tool having a parent material, a plating layer that has a high-level portion and a low-level portion formed as strips on the parent material at different heights along the direction intersecting the processing direction, and electrodeposited abrasive grains exposed from the surface of the plating layer. The difference in height of the plating layer is preferably 50-100% of the average particle diameter of the abrasive grains, the width of the high-level portion of the plating layer is preferably 150-200% of the average particle diameter of the abrasive grains, and the width of the low-level portion of the plating layer is preferably 100-800% of the average particle diameter of the abrasive grains.


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