The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Mar. 26, 2019
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Robert A. Stevenson, Canyon Country, CA (US);

Christine A. Frysz, Orchard Park, NY (US);

Richard L. Brendel, Carson City, NV (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/08 (2006.01); H05K 9/00 (2006.01); A61N 1/37 (2006.01); A61N 1/375 (2006.01); H05K 5/00 (2006.01); H05K 1/18 (2006.01); H03H 7/01 (2006.01); H01R 13/7195 (2011.01); H01G 4/40 (2006.01); H01G 4/35 (2006.01); H01G 4/06 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/08 (2013.01); A61N 1/3718 (2013.01); H01G 4/35 (2013.01); H03H 1/0007 (2013.01); H05K 5/0095 (2013.01); H05K 9/00 (2013.01); A61N 1/086 (2017.08); A61N 1/375 (2013.01); H01G 4/06 (2013.01); H01G 4/40 (2013.01); H01R 13/7195 (2013.01); H03H 7/1766 (2013.01); H03H 2001/0042 (2013.01); H03H 2001/0085 (2013.01); H05K 1/181 (2013.01); H05K 999/99 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.


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