The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Mar. 27, 2018
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Keith W. Seitz, Clarence Center, NY (US);

Xiaohong Tang, Williamsville, NY (US);

William C. Thiebolt, North Tonawanda, NY (US);

Jonathan Calamel, Williamsville, NY (US);

Thomas Shi, Williamsville, NY (US);

Thomas Marzano, East Amherst, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); H05K 5/00 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H01L 23/15 (2006.01); C03C 8/14 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); C03C 8/14 (2013.01); H01L 23/10 (2013.01); H01L 23/15 (2013.01); H01L 24/26 (2013.01); H05K 1/0306 (2013.01); H05K 3/0047 (2013.01); H05K 5/0095 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/361 (2013.01); C04B 2237/363 (2013.01); C04B 2237/365 (2013.01); C04B 2237/403 (2013.01); C04B 2237/408 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/09701 (2013.01);
Abstract

Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.


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