The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Dec. 12, 2016
Applicant:

Showa Glove Co., Himeji, JP;

Inventor:

Hidetoshi Kishihara, Hyogo, JP;

Assignee:

SHOWA GLOVE CO., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A41D 19/00 (2006.01); B29C 65/48 (2006.01); B29C 65/42 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
A41D 19/0089 (2013.01); A41D 19/0006 (2013.01); A41D 19/0044 (2013.01); B29C 65/02 (2013.01); B29C 65/484 (2013.01); B29C 66/1122 (2013.01); B29C 66/5344 (2013.01); B29C 66/71 (2013.01); B29C 66/7392 (2013.01); A41D 2300/52 (2013.01); A41D 2500/50 (2013.01); B29C 66/43 (2013.01); B29L 2031/4864 (2013.01);
Abstract

A glove with a sleeve is provided in which the bonding strength between the glove main body and the sleeve is great, allowing easy wearing and removal as well as easy overlapping of the glove main body and the sleeve upon bonding. The glove with a sleeve includes: a glove main body compromising rubber or a resin as a principal component; and a cylindrical sleeve comprising a thermoplastic resin as a principal component that is arranged to protrude from a cuff portion of the glove main body, in which the cuff portion of the glove main body is bonded to one end portion of the sleeve through a moisture-curing urethane-based hot melt adhesive. The moisture-curing urethane-based hot melt adhesive is preferably crosslinked. A post-curing thermal deformation temperature of the moisture-curing urethane-based hot melt adhesive is preferably no less than 80° C.


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