The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Oct. 24, 2019
Applicant:
Nec Network and Sensor Systems, Ltd., Fuchu, JP;
Inventors:
Masahiro Murakami, Tokyo, JP;
Norio Masuda, Tokyo, JP;
Assignee:
NEC NETWORK AND SENSOR SYSTEMS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20445 (2013.01); H05K 5/0217 (2013.01); H05K 7/20 (2013.01); H05K 7/209 (2013.01); H05K 7/20145 (2013.01); H05K 7/20909 (2013.01); H05K 5/023 (2013.01); H05K 5/04 (2013.01); H05K 7/20172 (2013.01);
Abstract
To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamberhouses the high voltage power supply module(the first electronic component). A second electronic component housing chamberhouses the TWT(the second electronic component). At least some of a first partition plateand a second partition plateare provided so as to face each other. A first gap part Gis provided between the first partition plateand the second partition plate