The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jan. 27, 2016
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Toshiki Ito, Kawasaki, JP;

Shiori Yonezawa, Tokyo, JP;

Keiko Chiba, Utsunomiya, JP;

Akiko Iimura, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); G03F 7/00 (2006.01); H01L 21/311 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); G03F 7/027 (2006.01); G03F 7/029 (2006.01); H05K 3/30 (2006.01); G02B 5/18 (2006.01); G02B 5/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0079 (2013.01); G03F 7/0002 (2013.01); G03F 7/027 (2013.01); G03F 7/029 (2013.01); H01L 21/0273 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01); H05K 3/30 (2013.01); G02B 5/1809 (2013.01); G02B 5/1852 (2013.01); G02B 5/3025 (2013.01); H05K 2203/107 (2013.01);
Abstract

Method of forming a pattern by arranging a photocurable composition on a substrate; bringing a mold having a concavo-convex pattern into contact with the composition; irradiating the composition with light to form a cured film; releasing the mold from the cured film; forming a reversal layer on the cured film having a concavo-convex pattern transferred from the mold; partially removing the reversal layer to expose the convexes of the pattern in such a manner that the reversal layer remains in the concaves of the pattern formed on the cured film; and etching the photocurable composition layer using the reversal layer remaining in the concaves as a mask to form a reversal pattern, wherein the mold is brought into contact with the photocurable composition in an atmosphere of a soluble gas having a solubility in the composition; and the soluble gas has a saturation solubility of 38% by volume or more.


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