The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jul. 03, 2019
Applicant:
City University of Hong Kong, Kowloon, HK;
Inventors:
Assignee:
City University of Hong Kong, Kowloon, HK;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H01P 7/10 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H01P 7/10 (2013.01); H01Q 1/2283 (2013.01); H05K 1/024 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 2201/10068 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/1461 (2013.01);
Abstract
A substrate-integrated device includes a substrate layer with a first dielectric constant and one or more dielectric vias, the one or more dielectric vias each includes a via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the via-hole. The second dielectric constant is larger than, preferably at least two times, the first dielectric constant.