The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jan. 31, 2019
Applicant:
Abb Schweiz Ag, Baden, CH;
Inventors:
Jorma Manninen, Vantaa, FI;
Mika Silvennoinen, Espoo, FI;
Joni Pakarinen, Vantaa, FI;
Kjell Ingman, Sipoo, FI;
Assignee:
ABB Schweiz AG, Baden, CH;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 21/58 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H05K 3/0061 (2013.01); H05K 3/341 (2013.01);
Abstract
A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.