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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10856376 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Nov. 08, 2018

Printed circuit board for integrated led driver

Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Zhihua Song, San Jose, CA (US);

Wouter Soer, San Jose, CA (US);

Ron Bonne, San Jose, CA (US);

Yifeng Qiu, San Jose, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Sophia T Nguyen

Int. Cl.
CPC ...
H05B 45/10 (2020.01); H05K 1/05 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01); H05B 45/50 (2020.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H05K 3/10 (2006.01); H05K 3/14 (2006.01); H01R 13/6591 (2011.01); H05K 9/00 (2006.01); H05B 45/37 (2020.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/18 (2006.01); H05K 3/16 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05B 45/10 (2020.01); H01L 25/167 (2013.01); H01L 25/50 (2013.01); H01R 13/6591 (2013.01); H05B 45/37 (2020.01); H05B 45/50 (2020.01); H05K 1/0203 (2013.01); H05K 1/0215 (2013.01); H05K 1/0224 (2013.01); H05K 1/0243 (2013.01); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/0061 (2013.01); H05K 3/107 (2013.01); H05K 3/146 (2013.01); H05K 3/303 (2013.01); H05K 3/4076 (2013.01); H05K 3/44 (2013.01); H05K 3/465 (2013.01); H05K 3/467 (2013.01); H05K 3/4608 (2013.01); H05K 3/4644 (2013.01); H05K 9/0084 (2013.01); H05K 9/0088 (2013.01); H05K 1/024 (2013.01); H05K 1/0251 (2013.01); H05K 1/0262 (2013.01); H05K 3/16 (2013.01); H05K 3/181 (2013.01); H05K 3/4661 (2013.01); H05K 3/4679 (2013.01); H05K 3/4688 (2013.01); H05K 13/00 (2013.01); H05K 2201/066 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09327 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

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