The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Nov. 07, 2019
Applicant:

Txc Corporation, Taipei, TW;

Inventors:

Wan-Lin Hsieh, Ping Cheng, TW;

Erh-Shuo Hsu, Ping Cheng, TW;

Shao-Po Sun, Ping Cheng, TW;

Sheng-Hsiang Kao, Ping Cheng, TW;

Yu-Shun Yen, Ping Cheng, TW;

Assignee:

TXC Corporation, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03L 1/02 (2006.01); H03L 1/04 (2006.01); G01K 13/00 (2006.01); H01L 23/34 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H03L 1/028 (2013.01); G01K 13/00 (2013.01); H01L 23/345 (2013.01); H03L 1/02 (2013.01); H03L 1/04 (2013.01); H05K 1/0212 (2013.01); H05K 1/181 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/184 (2013.01); H05K 2201/10075 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.


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