The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jan. 13, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Motoki Imanishi, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/567 (2006.01); H01L 23/00 (2006.01); H03K 17/74 (2006.01);
U.S. Cl.
CPC ...
H03K 17/567 (2013.01); H01L 24/45 (2013.01); H03K 17/74 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes: a first IGBT and a second IGBT to constitute an inverter; a primary-side IC chip to output an electrical signal responsive to an input signal; a first secondary-side IC chip to drive the first IGBT based on the electrical signal; and a second secondary-side IC chip to drive the second IGBT based on the electrical signal. The primary-side IC chip includes insulating elements electrically insulated from the first secondary-side IC chip and the second secondary-side IC chip. The first secondary-side IC chip is stacked on the first IGBT. The second secondary-side IC chip is stacked on the second IGBT.


Find Patent Forward Citations

Imanishi, Motoki. (2020). Semiconductor device (U.S. Patent No. 10855274). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10855274

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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