The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Aug. 06, 2017
Applicant:

D.m. Benatav Ltd., Petach Tikva, IL;

Inventor:

Dror Benatav, Tel-Aviv, IL;

Assignee:

D.M. BENATAV LTD., Petach Tikva, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H01R 43/02 (2006.01); H01R 4/02 (2006.01); H01R 4/70 (2006.01); H01R 4/62 (2006.01);
U.S. Cl.
CPC ...
H01R 43/02 (2013.01); H01R 4/021 (2013.01); H01R 4/70 (2013.01); H01R 43/0207 (2013.01); H01R 4/625 (2013.01); H01R 2201/12 (2013.01); Y10T 29/49174 (2015.01);
Abstract

A method of connecting a fine wire to an ultrafine wire, the fine wire exhibiting a first cross-section and the ultrafine wire exhibiting a second cross-section, the second cross-section smaller than the first cross-section, the method constituted of: providing an uninsulated portion of the fine wire exhibiting a flat surface; depositing a conductive material on the flat surface of the provided uninsulated portion of the fine wire; providing an uninsulated portion of the ultrafine wire; and bonding the provided uninsulated portion of the ultrafine wire to the deposited conductive material on the flat surface of the provided uninsulated portion of the fine wire by thermocompression.


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