The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Mar. 30, 2020
Applicant:

Soraa Laser Diode, Inc., Goleta, CA (US);

Inventors:

James W. Raring, Santa Barbara, CA (US);

Melvin McLaurin, Santa Barbara, CA (US);

Alexander Sztein, Santa Barbara, CA (US);

Po Shan Hsu, Arcadia, CA (US);

Assignee:

Soraa Laser Diode, Inc., Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/205 (2006.01); H01L 23/00 (2006.01); H01L 29/66 (2006.01); H01S 5/02 (2006.01); H01L 21/683 (2006.01); H01S 5/227 (2006.01); H01L 27/12 (2006.01); H01L 27/06 (2006.01); H01L 33/32 (2010.01); H01L 27/088 (2006.01); H01L 29/20 (2006.01); H01L 27/15 (2006.01); H01L 33/06 (2010.01); H01L 21/311 (2006.01); H01S 5/343 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 21/02458 (2013.01); H01L 21/311 (2013.01); H01L 21/6835 (2013.01); H01L 24/00 (2013.01); H01L 27/0629 (2013.01); H01L 27/0676 (2013.01); H01L 27/088 (2013.01); H01L 27/1255 (2013.01); H01L 27/1259 (2013.01); H01L 27/15 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/66136 (2013.01); H01L 29/66143 (2013.01); H01L 29/66318 (2013.01); H01L 29/66462 (2013.01); H01L 29/66916 (2013.01); H01L 33/007 (2013.01); H01L 33/0025 (2013.01); H01L 33/0066 (2013.01); H01L 33/0075 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01S 5/0203 (2013.01); H01S 5/0217 (2013.01); H01S 5/227 (2013.01); H01S 5/34333 (2013.01);
Abstract

A method for manufacturing a display panel comprising light emitting device including micro LEDs includes providing multiple donor wafers having a surface region and forming an epitaxial material overlying the surface region. The epitaxial material includes an n-type region, an active region comprising at least one light emitting layer overlying the n-type region, and a p-type region overlying the active layer region. The multiple donor wafers are configured to emit different color emissions. The epitaxial material on the multiple donor wafers is patterned to form a plurality of dice, characterized by a first pitch between a pair of dice less than a design width. At least some of the dice are selectively transferred from the multiple donor wafers to a common carrier wafer such that the carrier wafer is configured with different color emitting LEDs. The different color LEDs could comprise red-green-blue LEDs to form a RGB display panel.


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